By Young Bong Kang
I think privileged to be requested to give a contribution this little foreword for this glorious e-book written through my friend, younger Bong Kang. I first met Kang while he got here to India in 2007 and joined M/s Ever Electronics (one of the most OEM for the Korean titanic, L.G. Electronics) as my junior colleague. From the start, he inspired me along with his professionalism and in-depth wisdom of engaged on the shop-floor, relatively with SMT expertise. To be sincere, i might be in basic terms too satisfied to confess that although he used to be reporting to me, I learnt much from him concerning the SMT approach! He has a wealthy event of 24 years in SMT production, correct from the choice of machines, structure of machines, method parameters and fabric administration. Kang has positioned all his sensible wisdom and knowledge linked to SMT production and provided all its nuances in a truly easy-to-understand structure via this nice ebook. After having labored with Sharp and LG Electronics for with reference to two decades, i will be able to vouch for the truth that i haven't visible a ebook that's so functional in nature. It makes me notice that if basically I had had a chance to paintings with this type of genius in the course of my apprenticeship interval, i might were miles forward! I strongly suggest this e-book to all who desire to pursue a profession in Electronics’ production as SMT often is the expertise for the longer term… This e-book may be a important consultant to younger engineers in addition to creation managers. in addition for all those that derive excitement purely from the enjoyment of examining and studying, this ebook will certainly provide titanic delight…
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Extra resources for Essentials of SMT: Practical Know-How
Iii) Wrong setting of reflow temperature profile. 37 15) Floating: Cause: The state in which all the leads of the IC are not connected to the PCB and one side is raised and is floating on top of the PCB. 16) Scratches: Cause: The state in which there are scratches on the PCB surface. 17) PCB Bending: Cause: The case in which the PCB surface is not being flat and has bends. 18) Overheat: Cause: In the event of occurring ripples and over heat in the reflow oven and damaging in the components and the PCB.
34 12) Broken and Damaged Parts: Cause: The case of damaging components and peeling PCB. 35 13) Tombstone: Cause: The case in which one side of the component gets raised and its electrode makes no contact with the PCB. 36 14) Solder Balls: Cause: i) Due to improper stencil cleaning. ii) Due to wrong design of component pad on PCB. iii) Wrong setting of reflow temperature profile. 37 15) Floating: Cause: The state in which all the leads of the IC are not connected to the PCB and one side is raised and is floating on top of the PCB.
Falling off is very good so that the falling volume of a hole can be more than 95%. • Due to easy falling off, the width of pattern can be reduced. • Occurrence of bridge can be significantly reduced. • Manufacturing COB, COF mask is easy. • Because of long production period, getting short delivery time is difficult and the price is high. 3mm or less, BGA, CSP or 0603 and so on. It has high processing precision, excellent adhesion to PCB and falling of solder paste is very good. 07mm. • Flat and smooth-sided formation.