By Yoshihiko Imanaka
The basically booklet to pay attention exclusively on low temperature cofired ceramics, an enticing expertise for digital elements and substrates which are compact, mild, and supply high-speed and performance for transportable digital units.
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Extra info for Multilayered Low Temperature Cofired Ceramics (LTCC) Technology
In addition, its thermal expansion coefficient compared with resin materials and other ceramic materials is low, and it has the merit of excellent connection reliability for high density packaging of LSI components. For these reasons, LTCCs are regarded as a 2 Multilayered LTCC Technology promising future technology for the integration of components and substrates for high frequency applications. 1 Brief historical review The origin of multilayer ceramic substrate technology is said to lie in developments at RCA Corporation in the late 1950s, and the bases of current process technologies (green sheet fabrication technology, via forming technology, and multilayer laminate technology using the doctor blade method) were discovered at this time [6-8].
Patent No. 3,192,086, June 1965.  H. S. 3,189,978, June 1965.  B. Schwartz, “Microelectronics Packaging: II,” Am. Ceram. Soc. , Vol. 63, No. 4, (1984) pp. 577-81.  A. J. Blodgett, and D. R. Barbour, “Thermal conduction module: A high performance multilayer ceramic package,” IBM J. Res. , Vol. 3 , May (1982), pp. 30.  C. W. A. Chance, C. H. Bajorek, and R. E. Acosta, “The Thin-Film Module and High Performance Semiconductor Package”, IBM J. Res. , Vol. 3 , May (1982), pp 286-296.  “Low-Temperature Fireable Multi-layer Ceramic Circuit Board”, NIKKEI NEW MATERIALS, Aug.
1983), pp. 97-114.  R. R. Tummala, “Ceramics and Glass-Ceramic Packaging in the 1990s,” J. Am. Ceram. , Vol. 74, No. 5(1991), pp. 895-908.  K. Niwa, E. Horikoshi, and Y. Imanaka, “Recent Progress in Multilayer Ceramic Substrates,” Ceramic Transactions Vol. 97, Multilayer Electronic Ceramic Devices (American Ceramic Society, Westerville, OH, 1999)pp. 171-182. N. Kamehara, Y. Imanaka, and K. Niwa, “Multilayer Ceramic Circuit Board with Copper Conductor”, Denshi Tokyo, No. 26 (1987), pp.