Scientific Wet Process Technology for Innovative LSI/FPD by Tadahiro Ohmi

By Tadahiro Ohmi

As technology pushes nearer towards the atomic measurement scale, new demanding situations come up to gradual the speed of the miniaturization that has remodeled our society and fueled the knowledge age. New applied sciences are essential to surpass those stumbling blocks and become aware of the great development estimated through Moore's legislations. Assembled from the works of pioneering researchers, clinical rainy technique know-how for cutting edge LSI/FPD production provides new advancements and applied sciences for generating the following new release of digital circuits and displays.

This ebook introduces radical-reaction-based semiconductor production applied sciences that triumph over the constraints of the prevailing molecule-reaction-based applied sciences. It systematically info the techniques and underlying recommendations inquisitive about rainy method applied sciences and purposes. Following an creation to semiconductor floor chemical electronics, professional participants talk about the rules and expertise of high-performance rainy cleansing; etching applied sciences and approaches; antistatic expertise; rainy vapor face up to stripping expertise; and approach and protection applied sciences together with waste reclamation, chemical composition keep watch over, and ultrapure water and liquid chemical offer structures and fabrics for fluctuation-free facilities.

Currently, huge construction runs are had to stability the prices of buying and tuning apparatus for specialised working stipulations. clinical rainy technique expertise for leading edge LSI/FPD production explains the applied sciences and procedures used to fulfill the call for for type and occasional volumes that exists in latest electronic electronics market.

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Teramoto, K. S. Tseng, Appl. Phys. Lett. 60 (1992) 2126. 13. T. Ohmi, K. Matsumoto, K. Nakamura, K. Makihara, J. Takano, and K. Yamamoto, J. Appl. Phys. 77 (1995) 1159. 14. N. Miki, H. Kikuyama, I. Kawanabe, M. Miyashita, and T. Ohmi, IEEE Trans. Electron Devices 37 (1990) 107. 15. K. Kawada, H. Suzuki, Y. Maeda, and T. Ohmi, in: Proceedings 21st Symposium on ULSI Ultra Clean Technology, 1994, p. 352. 16. T. Watanabe, M. Nakamura, A. Ohki, K. Kawada, S. Miyoshi, S. K. Chen, and T. Ohmi, in: 1992 International Conference on Solid State Devices and Materials, Extended Abstracts, 1992, p.

For a diphasic system comprising a metal and an aqueous solution, the metal gets dissolved when, the pH and redox potential of the solution are controlled in such a way as to fit into the dissolution region (shadowed region) in the diagram. In a solution featuring low pH and high redox potential, the metal is dissolved in the form of its cation. In a weak alkali solution, the metal gets precipitated as hydroxide. In a solution with no oxidizing capability, metal gets precipitated in a metallic state (metallic atom).

References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 36 37 38 38 39 40 40 43 44 45 48 48 50 50 51 52 54 55 56 56 56 57 57 57 I. INTRODUCTION The advanced manufacturing process of ultra large-scale integration (ULSI) and flat panel display (FPD), in which circuits are fabricated in the nanometer order, is constantly engaged in battles against contamination. Even in the most advanced manufacturing process armed with cleanroom, 35 © 2006 by Taylor & Francis Group, LLC Scientific Wet Process Technology for Innovative LSI/FPD Manufacturing 36 process tools, and materials all of which feature uppermost cleanliness, the surface of substrates and devices being processed is always exposed to contamination introduced through various sources.

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